- Product
- Wire-to-Board Connector
- Pitch 1.5mm Wafer
Product Details
Pitch 1.5mm Wafer, 180°, DIP
Product Introduction
Material:
1. Housing: Nylon-66, UL94V-0.
2. Terminal: Copper alloy. Tin-plated.
Electrical:
1. Current rating: 1A AC.DC.
2. Voltage rating: 100V AC,DC.
3. Contact resistance: 20m ohms Max
4. Insulator resistance: 500M ohms Min.
5. Dielectric withstanding: 500V AC/Min.
6. Temperature: -25°C ~ +85°C.
Available pins: 02~13 contacts.